With higher performance demands than ever, various electronic devices, such as mobile phones, cameras, and ECUs mounted on automobiles, are becoming more integrated with sophisticated electronics. At the same time, electronic devices are required to be further miniaturized and have to be densified, which makes the heat problem in electronic devices more serious.
System-level modeling (or 1D simulation) software such as MapleSim can provide a thermal system with the necessary degree of detail, and is suitable for use at the initial stages of design, where CAD data may be unavailable. This technique is compatible with the Thermal Network Method (TNM), which can be executed after modeling to understand the thermal behavior of an electronic device. This whitepaper outlines the TNM and demonstrates the advantages of using a 1D CAE tool for this method.